Products

MEMS Foundry Service

Sony Semiconductor Manufacturing Corporation, utilizing its extensive experience in manufacturing MEMS & semiconductor technology processing, offers a wide range of MEMS Foundry services to support your company's development and mass production needs.

  • Foundry services:

    Wafer process development (development, engineering samples, low ~ high volume mass production)

  • Available processes:

    Bulk process (including SOI), surface process, semiconductor process.

  • Fab Location:

    Sony Semiconductor Manufacturing Corp, Kagoshima Technology Center

  • ISO Certifications:

    ISO9001, TS16949, ISO14001

MEMS Foundry Customer Engagement Flow

MEMS Foundry Customer Engagement Flow(task category between customer and our company)

JDA: Joint Development Agreement
WSSA: Wafer Supply & Services Agreement

MEMS Foundry Locations

MEMS Foundry Marketing/Business Development, Sony Electronics Inc. Component Solutions Business Division, San Jose, California, MEMS Foundry Marketing/Business Development, Sony Europe Limited, Strategic Technology Partnerships, Basingstoke, England, MEMS Foundry Manufacturing, Sony Semiconductor Manufacturing Corp., Kagoshima Technology Center, Kagoshima, Japan

MEMS Technology Introduction

1. Process capabilities

MEMS Foundry Business Start: April 1, 2004
Location Kirishima City, Kagoshima Prefecture, Japan
Clean Room
Clean rating Class 1-1000
Wafer size 6 inch
Production capacity Small volume engineering samples - mass production
Services Engineering samples, Production
ISO, etc. ISO9001, TS16949, ISO14001
Development/Production experience Sensor, Actuators
Process technology Bulk processing including SOI, Cavity-SOI, Surface processing, Mixed signal semiconductor processing
Equipment
Photolythography Stepper, Double sided aligner, Coater, Developer
Heat treatment/diffusion Diffusion, Ionic diffusion
Deposition LPCVD, PCVD, Sputter, Vapor deposition, Doped Poly, Epi Poly
Dry etch RIE, DeepRIE, Asher
Wet etch HF, KOH, Resist removal
Bonding Metal bonding, Glass frit bonding
Cleaning RCA, Organic cleaning
Other Plating, Lift off
LowStress SiN, LowStress Poly, LowStress Epi Si
Epi
Laser dicing (Stealth)
Design/Analysis LSI design, Analysis environment
Measurement/Evaluation LSI & MEMS measurement (Probing), Evaluation environment
Assembly/Packaging LSI assembly

2. Available materials

  1A 2A 3A 4A 5A 6A 7A 8 1B 2B 3B 4B 5B 6B 7B 0
  1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
1 1
H
  2
He
2 3
Li
4
Be
  5
B
6
C
7
N
8
O
9
F
10
Ne
3 11
Na
12
Mg
  13
Al
14
Si
15
P
16
S
17
Cl
18
Ar
4 19
K
20
Ca
21
Sc
22
Ti
23
V
24
Cr
25
Mn
26
Fe
27
Co
28
Ni
29
Cu
30
Zn
31
Ga
32
Ge
33
As
34
Se
35
Br
36
Kr
5 37
Rb
38
Sr
39
Y
40
Zr
41
Nb
42
Mo
43
Tc
44
Ru
45
Rh
46
Pd
47
Ag
48
Cd
49
In
50
Sn
51
Sb
52
Te
53
I
54
Xe
6 55
Cs
56
Ba
  72
Hf
73
Ta
74
W
75
Re
76
Os
77
Ir
78
Pt
79
Au
80
Hg
81
Tl
82
Pb
83
Bi
84
Po
85
At
86
Rn

3. Process technologies

  • TSV (Through Silicon Via)

    Features

    • High aspect ratio TSV
    • High-density TSV
  • WLP (Wafer Level Package)

    Features

    • Au - Si Eutectic Bonding
    • Vacuum Sealing
    • Au - Au Bonding
    • Glass Frit Bonding
    • Resin Bonding
  • Wafer bonding after dicing
  • Deep RIE Process

    Features

    • High aspect ratios
    • Various taper angles
    • Filling
  • Width (Top) : 1.25 µm, Width (Bottom) : 1 µm, Depth : 21.0 µm, Taper : 90.34 degree, A/R : 18.7
  • Width 20 µm, Depth 220 µm
  • This is an example by Deep RIE process technology. A pen can be seen through the etched wafer.
  • Epi Poly Process

    Features

    • Thick Poly-Si
    • Low-resistance Poly-Si
    • Low-stress Poly-Si
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