企业信息

开发、设计、生产活动

索尼半导体解决方案集团作为图像传感器领域的领军企业,集成了从商品企划到开发、设计、生产的全流程,为全世界提供高质量的最先进产品。

CMOS图像传感器的企划~量产流程的概要

【Product planning】Determine'ahet kind of product(device)to make'based on customer needs and business plan. → 【Specification Review】Review specifications of image sensors as well as lenses implemented together. → 【Design】Design the circuits of function aspects as a images sensor such as a drive timing,interfaces and image processing.Design pixels and readout circuits.→【Prototyping →【Evaluation】Verify accurate imaging and functions by shooting various subjects in a variety of environments(including dark rooms)→【Preparations for Mass Production】Measure image sensors with testers to obtain data for mass production.Test and verify correct operation even in hot/cold environments. →【Mass production】Aside from 【Product planning】 or 【Specification Review】,【Core Technology Development】New development of basic technologoes such as materials,pixel structures and drive mechanicsms to improve function and perfoemance.→【Design】

堆栈式CMOS图像传感器

『Design:Pixel section chip』①【Specification Review】Define pixel function implementation and connection with circuit section.→②【Circuit design (pixel/analog circuits) To meet specifications,design photoelectric conversion/drive structures;design image signal readout circuit and so on.
						『Design:Circuit section chip』①【Specification Review】Define functionality and implementation of pixel readout,signal processing circuits,and connection with pixel section.→②【Circuit design (pixel/logic analog circuits) Design each functional block that will meet defined specifications as a logic or analog circuit.
						→③【Simulation & Verification】Verify that circuit design results match defined specificatons. →④【Overall verification】Confirm throu simulation that no functional issues arise when both sections are combined.→repeat②〜④→⑤【Layout design】Convert circuit design into physically manufacturable element and wiring layout data.→⑥【Layout verification】Confirm that layout design results meet performance and characteristics criteria as designed. →⑦【Overall verification】Superimpose layout data of both sections to confirm connection if both sections.→repeat⑤〜⑦→Continue to Production.
『Production』Wafer processes (Front-end processes)【Substrate process】Photodiodes and other elements that convert incident light into charge are formed on silicon wafers.→【Wiring process】Each element formed in the substrate process is connected with metal wire.→【Stacking process】Pixel wafers and outsourced logic circuit wagfers are stacked.→【On-chip color filter process】Color filters that transmit each RGB light and on-chip lens are formed over pixels.→【Wafer measurement process】Product quality and reliability is confirmed in the water form.→『Assembly processes Back-end processes)』【Dicing process】Silicon wafers are cut into individual chip(dice).→【Die/wire bonding process】Chip(dice)are glued onto a metal lead frame,and electrodes are connected with a metallic material.→【Mold process】The package is sealeda with a resin sealant.→【Assembly measurement Process】Product quality and reliability is confirmed in the diced chip form.→【Packing, Shipment】Products are shipped to customers.
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