Diagonal 6.23 mm (Type 1/2.9) Approx. 2.19M-Effective Pixel Color CMOS Image Sensor

photo_IMX323LQN

Full HD Support High Sensitivity CMOS Image Sensor with a Super Small Package for Industrial Applications

Sony has commercialized the "IMX323LQN" CMOS Image Sensor that realizes a compact and thin package while maintaining low illumination performance equal to that of the existing Sony product (IMX222LQJ*) that improved sensitivity in the near infrared region for industrial applications. WLCSP (Wafer Level Chip Size Package) technology is used to realize a smaller size while maintaining performance such as visibility. The package size has been reduced to 1/8 the volume of the previous product, which helps to greatly reduce the set size.

* See the New Product Information released in August 2013

  • Frame rate 30 frame/s
  • On-chip 10-bit/12-bit  ADC
  • Pixel size: 2.8 µm-square unit pixel
  • Compact and thin package using WLCSP technology 7.55mm (H) × 5.75mm (V) × 0.77mm (t)
  • Improved sensitivity in the near infrared range

Exmor
* Exmor is a trademark of Sony Corporation. The Exmor is a version of Sony's high performance CMOS image sensor with high-speed processing, low noise and low power dissipation by using column-parallel A/D conversion.

Compact and thin package

The IMX323LQN is the first Sony CMOS image sensor for industrial applications to use WLCSP (Wafer Level Chip Size Package) technology, which realized a reduced package size and thickness (7.55mm (H) × 5.75mm (V) × 0.77mm (t)) compared to the existing product IMX222LQJ (12.8mm (H) × 10.8mm (V) × 1.95mm (t)). This makes it possible to shrink the set board size, which helps to reduce the camera size (Photograph 1).

Improved sensitivity in the near infrared range

Improved picture quality at low illumination is strongly demanded of cameras for industrial applications. To meet this demand, Sony also applied technology to the IMX323LQN that increases sensitivity in the near infrared range as well as the visible light range. This makes it possible to obtain clear images that enable to sufficiently discriminate subjects even under moonlit conditions. (Photograph 2).

*If the mouse cursor changes over the photo, you can click to see the larger version in a new window.

Photograph 1 Comparison of existing product and IMX323LQN  packages

Photograph 1

Existing product IMX222LQJ  New product IMX323LQN

Photograph 2 Image sample

Conditions: 0.1 lx, F1.4 (ADC 12 bit mode, 30 frame/s)

Photograph 2-1

Existing product IMX222LQJ Gain 42 dB

Photograph 2-2

New product IMX323LQN Gain 45 dB

Table 1 Device Structure
Item Existing product IMX222LQJ New product IMX323LQN
Image size Diagonal 6.4 mm
(Type 1/2.8)
Diagonal 6.23 mm
(Type 1/2.9)
Number of effective pixels 1984 (H) × 1225 (V)
Approx. 2.43M pixels
1985 (H) × 1105 (V)
Approx. 2.19M pixels
Unit cell size 2.8 µm (H) × 2.8 µm (V)
Supply voltage 2.7 V / 1.8 V / 1.2 V
Package 94 pin LGA 80 pin CSP BGA
Gain 0 to 42 dB (0.3 dB Step) 0 to 45 dB (0.3 dB Step)
Table 2 Image Sensor Characteristics
Item IMX222LQJ IMX323LQN Remarks
Sensitivity (F5.6) Typ. 510 mV 1/30s accumulation
Table 3 Basic drive mode
Drive mode Recommended number of recording pixels ADC Frame rate
Full HD 1920 (H) × 1080 (V)
Approx. 2.07M pixels
10 bit 30 frame/s
12 bit 30 frame/s
HD 1280 (H) × 720 (V)
Approx. 9.2M pixels
10 bit 60 frame/s
12 bit 30 frame/s

*Sony reserves the right to change products and specifications without prior notice.

VOICE

group photo_Designers

The IMX323LQN was commercialized to add the additional values of "compact and thin" to "high speed, high definition and high sensitivity" Sony CMOS image sensors. We feel proud that these added values are the result of all product team members working together to develop this device. Please consider Sony's continuously evolving Full HD compatible CMOS image sensors for industrial applications.

Designers (from the left)
Mr. Arai  Ms. Suzuki  Mr. Tateishi
Mr. Fukumoto  Mr. Igarashi  Mr. Oohata  Mr. Murai